Solder Reflow Vulcatherm’s Ceramic Infra-Red Heaters are used in Reflow Machinery in the production of surface mounted circuit boards Accurate temperature control is required throughout the process to enable the solder to be melted without damaging the components Initially the component is fixed into position with adhesive before entering the four zone reflow unit. In the first zone the solder paste is heated to release solvent used in printing the circuits. The second zone causes the flux to flow. The third and fourth zones increase the temperature progressively to 210°C to 220°C at which temperature reflow occurs Temperature control is achieved utilising embedded thermocouples within the heaters, monitored and controlled by computer software enabling accurate control to be achieved The programme allows changes in conveyor speed, zone temperature and the rate of temperature change to be adjusted Even temperature distribution and the non-colour selectivity of the emitters- provides enhanced manufacturing quality, reducing rework and scrap to a minimum Application Information Emitter Type V1 150W V1 300W V2 200W V2 250W Unit Rating 15.5 Kw Power Density 20.9kW M-2